本报告系统分析了中国高速互联产品行业的市场结构、技术演进、下游需求与竞争格局。随着AI技术向端云协同形态演进，以及国内数据量爆发式增长与算力规模持续扩张，高速互联产品作为连接算力与存力的核心纽带，其需求规模快速扩容。报告涵盖高速互联产品在人工智能与数据中心、汽车电子、消费电子、工业等终端领域的应用趋势，同时对存算运协同体系、ASIC定制与IP授权商业模式及国产化发展路径进行了深入研究。中国在高速互联产品市场规模、技术突破速度及场景落地深度上已形成显著优势。伴随高带宽、低时延、定制化需求的提升，以及国产IP自主化进程加速，高速互联产品行业未来将保持稳健增长，并呈现向高集成度、高性能与更广应用场景扩展的发展趋势。
This report provides a comprehensive analysis of China's high-speed interconnect products industry, covering market structure, technological evolution, downstream demand, and competitive landscape. With the evolution of AI technology toward a cloud-edge-end collaborative model, coupled with the explosive growth of domestic data volume and the continuous expansion of computing power scale, high-speed interconnect products, as the core link connecting computing power and storage capacity, are experiencing rapid demand expansion. The study examines application trends across key end-use sectors including artificial intelligence and data centers, automotive electronics, consumer electronics, and industrial applications, while also conducting an in-depth analysis of the computing-storage-transmission collaborative system, ASIC customization and IP licensing business models, and the development path of domestic localization. China has established significant advantages in terms of market scale, technological breakthrough speed, and scenario implementation depth of high-speed interconnect products. Driven by increasing demands for higher bandwidth, lower latency, and customization, as well as the accelerated process of domestic IP autonomy, the high-speed interconnect products industry is expected to maintain steady growth in the future, moving toward higher integration, improved performance, and broader application scenarios.
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沙利文 贾先生
E-mail: sean.jia@frostchina.com
