Sub-1GHz射频芯片及模块是指工作于1GHz以下频段，利用FSK、LoRa等调制技术，具备传输距离远、穿透性强、功耗低及组网灵活等特征的核心通信组件。当前，受益于物联网连接数的爆发式增长以及对长距离、低功耗无线连接需求的提升，该行业正从传统的无线抄表、安防报警领域，向工业物联网（IIoT）、智慧农业及车用电子等更广泛的场景加速渗透。展望未来，高集成度SoC与数模混合设计将成为技术演进的核心趋势，具备多协议兼容能力的收发一体芯片以及完善的SDK软件生态将取代单一硬件性能成为新的竞争高地，推动行业向更加智能化、系统化及低功耗化的方向持续演进。
Sub-1GHz RF chips and modules refer to core communication components operating in frequency bands below 1GHz. Utilizing modulation technologies such as FSK and LoRa, they are characterized by long transmission range, strong penetration capabilities, low power consumption, and flexible networking. Currently, driven by the explosive growth of Internet of Things (IoT) connections and the rising demand for long-range, low-power wireless connectivity, the industry is accelerating its penetration from traditional wireless metering and security alarm sectors to broader scenarios such as Industrial IoT, smart agriculture, and automotive electronics. Looking ahead, highly integrated SoC and digital-analog mixed design will become core trends in technological evolution. Transceiver chips with multi-protocol compatibility and robust SDK software ecosystems are poised to replace standalone hardware specifications as the new competitive high ground, driving the industry to evolve continuously towards greater intelligence, system integration, and power efficiency.
如果您对射频芯片及模块市场有进一步的研究需求，请联系我们：
沙利文 袁先生
E-mail: oliver.yuan@frostchina.com
