硅光技术凭借高度集成的核心技术路径，有效改善了传统方案的瓶颈。该技术以CMOS兼容工艺为基础，依托硅基材料的优异光电特性，将光波导、调制器、探测器、耦合器等数十种原本分散的光子器件，与电子控制电路一体化集成在单块硅基芯片上，实现信号传输、调制、探测、控制的全功能集成。
硅光芯片是硅光技术的核心载体，是以硅基衬底为光学介质，采用CMOS兼容工艺，将光波导、调制器、探测器、耦合器等光子器件单片集成的光电融合芯片，可实现光信号的产生、调制、传输与探测，具备高集成度、低功耗、低成本、可规模化量产四大核心优势，是AI算力、数据中心、5G/6G及自动驾驶的核心使能技术。
基于对全球硅光芯片行业的深度研究，弗若斯特沙利文公司（Frost & Sullivan）发布了《2026年全球硅光芯片行业独立研究报告》。
Silicon photonics addresses the fundamental limitations of conventional optical interconnect architectures through a highly integrated technological approach. Built on CMOS-compatible fabrication processes and leveraging the exceptional optoelectronic properties of silicon-based materials, the technology monolithically integrates onto a single silicon chip an array of photonic components—including optical waveguides, modulators, photodetectors, and couplers—that were previously implemented as discrete devices, alongside their associated electronic drive and control circuitry. The result is a fully integrated platform encompassing signal transmission, modulation, detection, and control within a unified chip-scale solution.
The silicon photonics integrated circuit (SiPIC) is the fundamental building block of this technology. Employing silicon-based substrates as the optical medium and fabricated via CMOS-compatible processes, the SiPIC achieves monolithic co-integration of key photonic components—optical waveguides, modulators, photodetectors, and couplers—into a single optoelectronic chip capable of optical signal generation, modulation, transmission, and detection. Its four defining attributes—high integration density, low power consumption, cost-effectiveness, and scalable volume manufacturability—position it as a critical enabling technology across AI compute infrastructure, data center interconnects, 5G/6G fronthaul and backhaul networks, and autonomous driving perception systems.
Based on in-depth primary research into the global silicon photonics industry, Frost & Sullivan has released the “2026 Independent Research Report on the Global Silicon Photonics Chip Industry”.
如果您对全球硅光芯片行业有进一步的研究需求，请联系我们：
沙利文 贾先生
E-mail: sean.jia@frostchina.com
