Good News on Listing | Frost & Sullivan Assists ZhaoYi Innovation Technology Group Co., Ltd. to Successfully List on the Hong Kong Stock Exchange(3986.HK)
Frost & Sullivan' Frost & Sullivan' Frost & Sullivan
MaxLinear Technologies Group Co., Ltd. (Stock Code:3986.HK) successfully listed on the Main Board of the Hong Kong capital market on January 13, 2026. The company is a global leader in integrated circuit design, having built a business matrix covering multiple product lines such as memory chips, microcontrollers (MCUs), and sensors. Frost & Sullivan (FrostSullivan,hereinafter referred to asFrost & Sullivan) provides exclusive industry advisory services for the listing of Microchip Technology Group Co., Ltd. We hereby extend our warmest congratulations on its successful listing.
Midea Group Co., Ltd. (hereinafter referred to as"Midea Innovation" successfully went public on January 13, 2026. The company plans to issue 2,891.58 million H shares, of which90%For international distribution,10% For public offering. The maximum issue price per share isHK$162.00, with a net raised capital of approximately HK$4.68 billion.
During the process of listing in Hong Kong, Frost & Sullivan mainly undertook the following tasks: helping the issuer accurately and objectively understand its positioning in the target market, using objective market data to discover, support, and highlight the issuer's competitive advantages, assisting the issuer, investment banks, and other intermediaries in completing the writing of relevant parts of the prospectus (such as overview, competitive advantages and strategy, industry overview, business, and other important sections), helping the issuer communicate with the Hong Kong Stock Exchange and investors, assisting investors in quickly understanding the market ecosystem and competitive landscape, and providing feedback on various industry-related issues to the Hong Kong Stock Exchange.
Frost & Sullivan has always been a leader in helping companies go public in Hong Kong. According toDuring the statistical period from January to December 2025 and the past 36 months, LiveReport big data showed that Frost & Sullivan provided listing industry advisory services to 82 (market share 72%) and 180 (market share 71%) Hong Kong-listed IPOs respectively, ranking first in terms of number. It has rich industry experience and communication skills with regulatory authorities, exchanges, investment and financing institutions, and various related organizations.
PART/ 1
Investment highlights
· The company has been deeply involved in the specialized storage chip industry for twenty years.With fourteen years in the MCU field, it has become a well-known enterprise in the Chinese mainland for dedicated memory chips and MCUs, creating a globally influential brand of dedicated memory chips and MCUs;
According to the Frost & Sullivan report, the company's products rank among the world's best in multiple fields:
· atnor In the Flash field, the company ranks second globally and first in Mainland China, with a global market share of 18.5%;
· atNAND gate In the Flash field, the company ranks sixth globally and first in Mainland China, with a global market share of 2.2%;
· in nicheIn the DRAM field, the company ranks seventh globally and second in Mainland China, with a global market share of 1.7%;
· atIn the MCU field, the company ranks eighth globally and first in Mainland China, with a global market share of 1.2%;
· In the fingerprint sensor chip field, the company ranks second in Mainland China, with a market share in Mainland China of approximately10%.
PART/ 2
Global Market Overview of ASIC Memory Chips
Semiconductor memory is a broad category of memory products designed for mass market applications with standardized performance requirements. Semiconductor memory can be further divided into dedicated memory and general-purpose memory based on the characteristics and technical features of specific applications.
Dedicated memory refers to memory products that are applied in specific industries, have unique technical requirements (such as high reliability, low power consumption, or extreme environmental operation), or possess competitive advantages in specific niche markets. It mainly includes niche types.DRAM, SLC NAND FlashandNORFlash. Such products can utilize mature or dedicated process nodes, focusing more on cost to meet stringent application requirements. Dedicated memory typically has the following characteristics: (i) It can serve a wide range of downstream application areas, such as consumer electronics, automotive, industrial applications (such as industrial automation, energy storage and battery management), personal computers and servers, Internet of Things and network communications, etc.; and(ii)In different downstream industries and application scenarios, the requirements for storage capacity, bandwidth, temperature thresholds, and voltage vary. nicheDRAM, SLC NAND FlashandNOR FlashClassified as dedicated memory chips, they are designed for specific application domains and require customized features such as higher reliability, longer product life cycles, and enhanced durability. Unlike general-purpose memory, dedicated memory mainly serves niche markets such as industry and automotive, where stringent technical requirements may not be met by standardized solutions.
2024In the year, the global market scale of dedicated storage was136billions, including nicheDRAMcontribution85billion US dollarsnorFlashfor28billion US dollarsSLCNAND Flash memoryfor 23billion US dollars. Looking ahead to the next five years, the dedicated storage market will see growth due to the total amount of data as well as the endAIContinuing growth is driven by the continuous demand for low-power, high-reliability storage solutions in fields such as automotive electronics, with the market size to7.1%The compound annual growth rate continues to expand, expected2029Year is coming208billion US dollars. Specifically, it is expected2029Yearly income-growth orientedDRAMwill increase132billion US dollarsnorFlashincreased to42billion US dollarsSLCNAND Flash memorywill increase34billion dollars.
Data source: Analysis by Frost & Sullivan
Market Drivers for Specialty Storage Chips
● The popularization of AI intelligent devices has boosted the demand for capacity of dedicated storage chips
With consumer endpoint devices (such as smartphones,PCs, wearable devices, and smart home products are continuously transforming towards AI. The demand for data processing and storage capabilities in devices has significantly increased. Such devices require larger-capacity, faster, and more reliable chips to support intelligent functions such as multimodal interaction and large model operations, driving the evolution of dedicated storage chips towards larger capacities.
● car"Three Modernizations" drive the automotive-grade storage demand
automobile industry"Three modernizations" place higher demands on data storage reliability, temperature and vibration resistance, and real-time read/write performance. For example, in intelligent driving scenarios, massive sensor data generated by cameras and lidar requires local high-speed caching and stable writing, driving the development of high-performance NORs. The demand for Flash has surged; at the same time, the in-vehicle infotainment systems carried by intelligent cockpits, multimedia stream processing, and OTA firmware upgrades are also placing higher standards and greater demands on niche DRAM. As the global electric vehicle market continues to expand, automotive-grade memory chips are becoming another important growth engine following the consumer electronics sector.
● The AI era brings opportunities to various types of storage chip enterprises
In the AI era, both cloud-side and endpoint devices have a massive demand for storage products, creating development opportunities for the entire storage industry. In this process, new products and technical forms emerging in the dedicated storage market are creating new profit margins for enterprises.
PART/ 3
globalMCU Market Overview
Microcontroller UnitAn MCU (Microcontroller Unit) is a small integrated circuit with functions similar to those of a microcomputer, typically integrated CPU, memory, data converter, andI/OKey functional modules such as APIs.MCU Designed to control specific functions within large-scale electronic systems, it is therefore very suitable for embedded systems.MCU Control components or devices widely used in various fields, including industrial automation, automotive electronics, and home appliances. For example, the microcontroller inside a washing machine is responsible for managing the motor, water level, and user interface buttons. Similarly,MCU Also used in electronic thermostats, remote controls, and basic IoT sensors ——These devices require real-time control but do not have high demands on processing power and memory.MCU Supported by the operation of billions of end devices, it is a key infrastructure in the digital economy. In contrast, on-chip systems (SoC) is a more complex integrated chip that integrates CPU, also integrated A series of other components such as GPUs, DSPs, memory controllers, wireless modules, and advanced peripherals. SoC Designed to perform more complex and diverse functions, supporting the entire system including smartphones, tablets, and advanced embedded applications, rather than just control components or devices. In summary,MCU Suitable for simple real-time control tasks with limited resources,SoCIt is suitable for complex applications that require powerful processing capabilities and multiple integration functions.
In terms of market scale,2024 GlobalMCUMarket scale has reached197billion US dollars2020 till2024The compound annual growth rate for the year is 6.3%. Looking ahead, asAIContinuously penetrating into various fields, the functional complexity and intelligence level of automotive electronics, industrial control systems, consumer electronics, and other terminals are improving simultaneously, enabling the market toMCUThe demand is constantly increasing. As a result, electric bicyclesMCUThe value can be higher than that of an oil car super60%.
Data source: Analysis by Frost & Sullivan
PART/ 3
Global Analog Chip Market Overview
The analog chip is mainly responsible for power conversion and signal acquisition./Regulation can be divided intoPMICThere are two main categories of signal chain chips: the former focuses on energy conversion, voltage regulation, and current management, while the latter handles functions such as sensing, interfacing, conversion, clocking, and amplifying analog signals sent by sensors. Together, they form the key bridge for digital systems to interact with the real physical world.
With the worldThe construction of AI data centers is accelerating, the penetration rate of electric vehicles in terms of electrification and intelligence continues to rise, as well as the intelligent upgrade of industrial control and consumer electronics systems. The global analog chip market is entering a new growth cycle, with the market size expected to grow from $83.1 billion in 2025 to $112.8 billion by 2029, with a compound annual growth rate of 7.9% during this period.
Looking at the segmented market,With its core role in key application scenarios such as AI server power supply systems, electric vehicle electric drive platforms, and portable terminal fast charging solutions, PMIC's market size is expected to grow at a compound annual rate of 8.3% from 2025 to 2029.
Data source: Analysis by Frost & Sullivan
PART/ 4
Analysis of the competitive landscape of the industry in which the company operates
NORFlash sector
2024Year, globalNOR FlashThe competitive landscape of the market shows relative stability and high concentration, with the top three companies accounting for approximately [X]% of the total market size. 63.2%. Among them, our company2024The annual revenue is about5.122billion US dollars, with a market share of approximately 18.5%, ranking second among global companies and also the highest-ranked mainland Chinese company. In addition to our own company, NORFlashThe main market participants in the field also include Hua Bang Electronics Co., Ltd., Wang Hong Electronics Co., Ltd., and Infineon Technologies AG.
Data source: Analysis by Frost & Sullivan
SLC NANDFlash sector
2024Year, globalSLC NAND FlashThe market share is highly concentrated among overseas and Taiwanese manufacturers, with the top three companies accounting for a total of 69.4%. The Company relies on approximately0.5The business revenue of hundreds of millions is ranked globallySLC NAND FlashMarket No. 6, also the highest-ranked mainland Chinese company. In addition to our company,SLCNAND Flash memoryThe main market participants in the field also include Kymeta Corporation, Micron Technology Co., Ltd., and Hua Bang Electronics Co., Ltd.
Data source: Analysis by Frost & Sullivan
nicheDRAM sector
2024In 20XX, global nicheDRAMThe market share is highly concentrated among large overseas manufacturers, with the top three companies accounting for approximately [X]% of the total market size. 69.1%. Among them, our company2024The annual revenue is about1.464billion US dollars, with a market share of approximately 1.7%, ranking seventh among global companies and second among mainland Chinese companies. In addition to our company, there are niche-typeDRAMThe main market participants in the field also include Samsung Electronics Co., Ltd., Micron Technology Corporation, andSKHailisi Company.
Data source: Analysis by Frost & Sullivan
MCU sector
2024Year, globalMCUThe competitive landscape of the market shows relative stability and high concentration, with the top five companies accounting for approximately [X]% of the total market size. 81.2%. Among them, our company2024The annual revenue is about2.306billion US dollars, with a market share of approximately 1.2%, ranking eighth among global enterprises and first among mainland Chinese enterprises. In addition to our company, MCU The main market participants in the field also include Infineon Technologies AG, Renesas Electronics Corporation, and STMicroelectronics N.V.
Data source: Analysis by Frost & Sullivan
PART/ 5
Barriers to entry into the semiconductor market
● R&D innovation and product development capability barriers
The chip design industry is a typical technology-intensive sector. Chip companies need to possess forward-looking industry judgment, define product specifications in advance, and grasp the direction of technological evolution. The chip design process involves multidisciplinary collaboration, requiring the coordination of complex aspects such as circuit design, architecture design, system integration, software and hardware collaboration, and verification testing. It places extremely high demands on the capabilities of R&D teams. Chip development has a long cycle and high verification costs, requiring continuous iteration and deep technical accumulation. Especially in the fields of branded consumer electronics, automotive-grade, industrial control, and other highly reliable areas, the product development tolerance for failure is extremely low, raising the entry threshold. For example,SLCNANDIt is commonly used in fields such as network communication devices, smart security, industrial control, and automotive, where there are extremely high requirements for data write stability and power-off protection performance. To meet this characteristic, chips need to introduce mechanisms such as multi-level voltage write control and redundant verification algorithms during the circuit design phase. The R&D process requires repeated verification of erase/write life and data retention under extreme voltage and temperature conditions, increasing the complexity of product definition, design, and verification.
● Customer and Brand Barriers
Chips are the cornerstone of electronic devices, and their reliability and stability directly determine the performance and competitiveness of end products. The main downstream customers in the industry usually maintain long-term stable cooperation with existing chip suppliers, both parties having strict requirements and high tacit understanding regarding product quality, delivery, and service processes. For example, niche-orientedDRAMIn industrial applications (such as industrial automation, energy storage, and battery management), long-term compatibility and stability testing with customers are essential. It is difficult for new entrants to break away from their customers' reliance on existing suppliers in the early stages. Existing chip suppliers have established a good brand image through long-term market competition, while new companies face significant challenges in winning customer trust, building channels, and acquiring orders.
● Quality control capability barrier
In the chip design phase, quality is not only reflected in the correctness of functionality but also in product consistency, reliability, and stable performance across multiple scenarios. Mature enterprises build a full-process quality verification system, from front-end architecture design and post-simulation verification to collaborative optimization during the packaging and testing stages, ensuring that products meet high-standard quality requirements before mass production. For example, automotive-gradeNOR FlashOften used on automotive dashboards,ADAS For critical systems, such chips must pass throughAEC-Q100Standard certification, along with meeting the long-term stable operation requirements under extreme environments such as high temperature, high humidity, and high vibration, places extremely high demands on product consistency, reliability, and a comprehensive quality verification system before leaving the factory. At the same time, leading enterprises have established testing specifications and reliability evaluation mechanisms covering multiple product lines based on long-term technical accumulation, ensuring that chips can maintain high-performance stability and long-term operational reliability in various application scenarios. New entrants face difficulties in establishing an equivalent quality assurance system in the short term due to a lack of substantial verification data, patent support, and customer-side collaboration mechanisms.
● Supply chain barriers
Chip design companies need to ensure the smooth mass production and stable delivery of their products by having the ability to coordinate key links such as wafer foundry and packaging testing. Leading companies have formed deep cooperation mechanisms with multiple upstream and downstream entities through long-term accumulation, possessing higher collaborative efficiency and resource allocation capabilities, effectively ensuring product quality and delivery stability. By establishing a full-process supply chain management system covering design, verification, tape-out, testing, and delivery, leading manufacturers can quickly respond to customer needs, enhance supply chain resilience, and ensure business continuity. For example,norFlashIt is commonly used in scenarios where high startup speed and data accuracy are required. Downstream customers generally focus on stable delivery and verification of compatibility, hence chip design companies need to cooperate with manufacturers with mature production lines and reliable delivery capabilities for a long term. New entrants often find it difficult to establish a supply chain response system and delivery capability at the same level in the early stages due to limited business scale and insufficient customer loyalty.
● talent barrier
The semiconductor industry highly relies on compound talents with many years of experience, especially in key areas such as chip front-end design, quality verification, and reliability testing. These sectors have high professional barriers and long training cycles. Currently, there is a tight supply of high-end chip design and quality engineering talents globally, with a large number of core technical backbones concentrated in leading enterprises for an extended period. New entrants not only find it difficult to attract senior engineers with complete project experience but also struggle to quickly establish a design coverage network.—Verification —The complete technical team involved in delivery severely restricts product development efficiency and project delivery capabilities. For example, SLCNAND Flash memoryKey modules involved in design, such as power outage data protection, voltage regulation, and lifespan management, are often developed and optimized by senior engineers with over a decade of experience. This talent resource is highly concentrated in leading enterprises, further raising the entry threshold for the industry.
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