Cooperation Invitation | Frost & Sullivan is about to release the '2026 Development White Paper on the Super Node Industry Chain of China's Intelligent Computing Centers'.

The application of artificial intelligence continues to deepen, with large model training, complex reasoning, and industry intelligence accelerating, posing higher demands on the computing efficiency, interconnection bandwidth, and resource coordination capabilities of intelligent computing infrastructure. As application scenarios such as hybrid expert models (MoE), long context, and high-concurrency reasoning expand, the traditional server architecture faces challenges in inter-card communication, memory access, and system expansion. The construction of intelligent computing centers is evolving from the enhancement of single-card performance and device scale to the coordinated optimization of system architecture and effective computing power. The super-node architecture, which connects multiple physical devices via high-speed interconnection to enable coordinated use of computing resources, is an important direction for the upgrade of intelligent computing infrastructure, driving the coordinated development of components such as chips, interconnection, whole-case cabinets, power supply and distribution, liquid cooling, and basic software, offering new market opportunities for upstream and downstream enterprises in the industrial chain.

Based on its long-term insights into China’s computing infrastructure and related industrial chains, Frost & Sullivan (hereafter referred to as "Frost & Sullivan") will initiate the preparation and drafting of the '2026 White Paper on the Development of the Super-node Industrial Chain in China’s Intelligent Computing Centers'. The white paper will provide a multi-dimensional analysis, combining the panoramic map of the industrial chain, technical route breakdown, market competition landscape, and corporate practice cases, to systematically study the technical evolution, value division, and commercialization path of the super-node industry, deeply understanding industry trends and providing industry-focused global perspectives for industrial participants.

This white paper, based on the construction and upgrade needs of China’s intelligent computing centers, systematically outlines the panoramic development of the super-node industry, clarifies the technical essence and application boundaries of super-node, analyzes the core drivers of industry development regarding large model training and reasoning needs, interconnection technology evolution, and software and hardware coordination; it also distinguishes between internal high-speed interconnection (Scale-up) and cluster expansion (Scale-out) functions within super-node at the technical level, compares different interconnection architectures and resource organization methods, studies key capabilities such as bandwidth, latency, memory capacity, scalability, and reliability, and examines the implementation pathways for super-node to enhance effective computing power and task execution efficiency.

On this basis, the white paper will systematically break down the upstream AI acceleration chips, supporting storage, and high-speed interconnection components, the midstream servers, whole-case cabinets, and system integration, as well as the downstream cloud service providers, telecom operators, intelligent computing center operators, and industry users—covering the panoramic industrial chain and value chain logic, including key links such as interconnection chips and switching equipment, connectors and cables, optical interconnection, power supply and distribution and liquid cooling, communication databases and resource scheduling—and conduct in-depth analyses of key enterprises across the upstream and downstream of the industrial chain; additionally, the white paper will examine product selection, adaptation verification, deployment delivery, and operation and maintenance implementation requirements for new intelligent computing center construction and existing data center renovation scenarios, and analyze the matching relationship between different technical routes and customer needs.

Furthermore, the white paper will, based on representative products and project practices, study the engineering and commercial value of super-node, including effective computing power, system availability, energy consumption, and total cost of ownership, analyze the development trends in directions such as domestic computing power adaptation, open interconnection ecosystem, and whole-case cabinet delivery, and assess the core challenges faced by industrial coordination and large-scale deployment; it will also include companies from the upstream and downstream of the industrial chain that cooperate with it, presenting their business areas, product layout, technical platforms, and application cases, and showcasing their core competitiveness and product characteristics.

Frost & Sullivan sincerely invites outstanding enterprises in the super-node industrial chain of intelligent computing centers to participate in this research, including AI chip and interconnection chip companies, connector and cable and optical interconnection manufacturers, server and whole-case cabinet manufacturers, power supply and distribution and liquid cooling companies, basic software and system integration service providers, as well as cloud service providers, telecom operators, and intelligent computing center operators. Frost & Sullivan looks forward to the joint participation of multiple parties within the industrial chain in the research and publication process, forming a rational expression and consensus accumulation on industry development under a professional analysis framework, and working together to promote the high-quality development of the super-node industry in China’s intelligent computing centers.