Semiconductor equipment, as a critical foundation for wafer fabrication, advanced packaging, and yield control, is entering a key stage of technological upgrading and supply chain restructuring. The global market continues to expand, driven by AI computing demand, advanced process nodes, and advanced packaging, while China maintains strong momentum supported by fab capacity expansion, localization efforts, policy incentives, and capital investment. Metrology and inspection equipment, nano-scale patterned wafer defect inspection tools, and advanced packaging inspection equipment are high-barrier segments with relatively low localization rates and strong growth potential. With the accelerating adoption of Chiplet, 2.5D/3D packaging, and increasingly complex manufacturing processes, the industry is evolving toward higher precision, greater stability, intelligent operation, and stronger domestic self-sufficiency.
半导体设备作为晶圆制造、先进封装与良率控制的核心支撑，正处于技术升级与供应链重构的关键阶段。全球市场在AI算力、先进制程和先进封装需求带动下持续扩张，中国市场则在晶圆厂扩产、国产替代和政策资本支持下保持高景气。量检测设备、纳米级有图形晶圆检测设备及先进封装检测设备具备较高技术壁垒，是当前国产化率较低但成长空间突出的关键赛道。随着Chiplet、2.5D/3D封装及复杂制程加速落地，行业将进一步向高精度、高稳定性、智能化和自主可控方向演进。
