List Announcement | Frost & Sullivan Supports Jianjie Electronic Technology (Jiangsu) Co., Ltd. in Successfully Listing in Hong Kong (6675.HK)

List Announcement | Frost & Sullivan Supports Jianjie Electronic Technology (Jiangsu) Co., Ltd. in Successfully Listing in Hong Kong (6675.HK)

Published: 2026/06/17

Frost & Sullivan, referred to as "Frost & Sullivan", provided exclusive industry consulting services for MagnaTEC (Jiangsu) Co., Ltd. (stock code: 6675.HK) during its listing on the Hong Kong capital market main board on June 17, 2026. The company is a global leading supplier in the field of wireless sensing SoC, dedicated to offering innovative sensing chips. Its sensing chips have been upgraded to wireless and SoC formats, and are applied in high-growth vertical industries such as energy storage, industrial electronics, robotics, and consumer electronics. Frost & Sullivan provided exclusive industry consulting services for MagnaTEC (Jiangsu) Co., Ltd.’s listing on the Hong Kong market, and we extend our warm congratulations on its successful listing.

MagnaTEC (Jiangsu) Co., Ltd. (referred to as "MagnaTEC") successfully listed on the stock market on June 17, 2026. The company plans to issue 53,407,000 H shares, including 48,066,200 shares for international offerings and 5,340,800 shares for public offering sales. The issue price per share is HK$18.36, generating a net fundraising amount of approximately HK$980 million.

During the listing process, Frost & Sullivan performed the following key tasks: helping the issuer accurately and objectively understand its position in the target market, using objective market data to identify, support, and highlight the issuer’s competitive advantages, assisting the issuer, investment banks, and other intermediaries in drafting important sections of the prospectus (such as overview, competitive advantages and strategy, industry overview, business, etc.), facilitating communication between the issuer and the Stock Exchange and investors, helping investors quickly understand the market ecosystem and competitive landscape, and assisting the issuer in responding to various questions from the Stock Exchange regarding the industry.

Frost & Sullivan has always been a leader in helping companies list on the Hong Kong market. According to LiveReport Big Data (data as of March 31, 2026), over the past 36 months and 12 months, and from January to March 2026, Frost & Sullivan provided listing industry consulting services for 195 (market share: 71%), 101 (market share: 73%), and 30 (market share: 77%) Hong Kong IPO listings, ranking first in terms of number of cases. It possesses rich industry experience and communication skills with regulatory authorities, exchanges, investment institutions, and related organizations.

Part.01

Investment Highlights

  • The company is a top-tier wireless sensing SoC supplier, focusing on the development of mission-critical automotive sensing chip markets. It is the first company in China to mass-produce TPMS SoC and BLE TPMS SoC.

  • The company has developed an efficient adaptive sensing SoC platform powered by proprietary technology, enhancing product capabilities.

  • Centered around customers, the company promotes collaborative cooperation and has a strong customer base. Top domestic automotive OEMs in China ranked among the top ten in 2025 have adopted the company’s products.

  • The company has extensive experience in supply chain coordination and high-quality delivery capabilities, ensuring reliable large-scale delivery.

  • The company expands applications in automotive sensing and naturally extends into related fields, seizing commercial opportunities.

  • The company has a experienced and visionary management team and strategic partnerships with industry shareholders, supporting continuous innovation.

According to Frost & Sullivan reports:

  • In 2025, the company ranked third in the global automotive wireless sensing SoC market by revenue.

  • In 2025, the company ranked first in the Chinese automotive wireless sensing SoC market by revenue.

  • In 2025, the company ranked third in the global automotive wireless TPMS SoC market by revenue.

  • In 2025, the company ranked first in the Chinese automotive wireless TPMS SoC market by revenue.

Part.02

Overview of the Global and Chinese Wireless Sensing SoC Industry

sensing SoC is a miniaturized electronic device, similar to a “sensor officer” of a device. It detects specific physical quantities such as voltage, current, impedance, temperature, pressure, humidity, and light, and converts them into electrical signals that can be recognized and processed by electronic systems. Wireless sensing SoC further integrates low-power wireless communication modules and edge computing capabilities on top of traditional sensing SoC. Through system-level integration, wireless sensing SoC combines components and subsystems required for wireless sensing into a single microchip, providing both physical parameter sensing capabilities and local data processing and wireless transmission. With high integration of sensing, computing, and communication, wireless sensing SoC offers a unified, lightweight, and low-power sensing platform for various applications, including automotive, industrial, and energy storage scenarios.

Part.03

Overview of the Global and Chinese Automotive Wireless Sensing SoC Industry

Automotive-grade chips are integrated circuits designed, manufactured, and tested according to strict automotive industry standards. These chips can operate reliably under extreme temperature, EMI, and humidity fluctuations, and must meet strict requirements for high reliability, long lifespan, and functional safety. Automotive chips are key components supporting autonomous driving, intelligent cockpits, chassis control, power systems, and vehicle electronic devices, and are fundamental to intelligent and electrified transportation. Automotive-grade SoCs are specially designed, manufactured, packaged, and tested to meet strict automotive requirements. Compared to consumer and industrial SoCs, automotive-grade SoCs have much higher standards in performance, functional safety, reliability, and lifespan. Automotive-grade SoCs typically comply with AEC-Q100 reliability and ISO 26262 ASIL D road vehicle functional safety certifications, and are developed under the IATF 16949 quality management system to ensure stable and safe operation throughout the vehicle’s life cycle.

Automotive sensing SoC is an embedded semiconductor device that integrates sensing, signal processing, and communication modules, used to monitor the real-time operation of various subsystems in vehicles. They are widely distributed in vehicles to collect critical data supporting safety, energy management, and intelligent control. Automotive sensing SoC can be classified by connectivity (wireless and wired sensing SoC) or function (such as TPMS, BMS/BPS, smart general sensing chips, etc.). TPMS SoC, BPS SoC, and smart general sensing chips belong to broader categories within the automotive sensing SoC market, which includes integrated chips for processing, controlling, and transmitting data collected from various vehicle sensors to improve driving safety, energy efficiency, and comfort.

Automotive wireless sensing SoC is a specialized type of automotive-grade SoC designed for real-time environmental sensing and short-range wireless communication. Integrated with vehicle sensors, they collect critical data such as voltage, current, impedance, tire pressure, temperature, humidity, acceleration, and gas concentration. These SoCs integrate sensing interfaces, microcontrollers, wireless transceivers (such as Bluetooth, Ultra-Wideband (UWB)), and low-power processing units into a compact package. By enabling wireless data collection, edge processing, and communication with domain controllers or central electronic control units, they reduce wiring complexity and enhance system flexibility. Currently, wireless TPMS SoC is the most mature application of automotive wireless sensing SoC. Other automotive wireless sensing SoC, such as wBMS SoC, are still in the early stage of mass production.

With the continuous improvement of global TPMS-related regulations and standards, the global and Chinese wireless TPMS SoC industry has seen sustained growth over the past five years and is expected to expand further in the next five years.

As electric vehicle platforms transition to high-voltage designs, battery modularization becomes more common, and automakers seek to reduce wiring, increase scalability, and improve cost-effectiveness. The adoption rate of automotive wBMS SoC will continue to rise in the coming years. It is expected that the penetration rate of global and Chinese automotive wBMS SoC will grow from less than 1% in 2027 to approximately 30% by 2030. With its advantages in the development of power batteries and new energy vehicles, the market size of Chinese automotive wBMS SoC is expected to grow rapidly.

Part.03

Market Drivers and Development Trends of the Automotive Wireless Sensing SoC Industry

NEV Growth and Battery Safety Drive the Development of Wireless Sensing SoC

As the world transitions to clean energy systems, the increasing popularity of NEVs has driven strong demand for automotive sensing SoC, especially those using wireless technology. Wireless sensing SoC, used in wireless TPMS and wireless BMS applications, are gradually replacing traditional wired architectures due to their complexity and increased weight. For example, low-power Bluetooth SoC in TPMS not only reduces wiring but also reduces vehicle weight and increases driving range. Similarly, wBMS SoC improves system reliability and monitoring accuracy while simplifying electrical layout. As wireless sensing technology matures and its value is recognized, the application of wireless sensing SoC is expected to accelerate, promoting the automotive industry toward higher levels of lightweighting, digitalization, and energy efficiency.

Regulatory Requirements Drive the Rise of Automotive Wireless Sensing SoC

Regulatory requirements and safety standards are accelerating the adoption of wireless sensing SoC in the automotive industry. Global regulations related to automotive safety, energy efficiency, and environmental impact are directly driving the integration of wireless sensing technologies. In China, mandatory TPMS requirements have greatly promoted the adoption of TPMS. Meanwhile, global regulations on BMS are becoming stricter, driving progress in related sensing technologies. For example, China’s “Requirements for Power Battery Safety in Electric Vehicles” (GB 38031-2025) effective in July 2026, and the EU’s new battery regulations adopted in 2023 and fully effective in August 2025, both set new standards for battery safety, monitoring, and lifecycle management. Although neither regulation requires the installation of wBMS SoC, they create conditions that may accelerate its adoption. China’s GB 38031-2025 raises safety thresholds, changing the requirement from issuing warning signals at least five minutes before fire or explosion to ensuring “no fire or explosion,” and adding bottom impact tests to evaluate structural safety. These stricter standards increase the need for rapid, near-battery detection of abnormal thermal events. Given the limitations of wired BMS sensor solutions in terms of wiring length, cost, and layout, wBMS SoC is expected to be used to achieve more agile monitoring and better safety coordination under strengthened regulatory frameworks.

Wireless Sensing SoC Promotes Smart Lightweight Automotive Design

The increasing complexity of smart car functions and the industry’s shift toward centralized E/E architecture are accelerating the adoption of wireless sensing SoC in automotive applications. Wireless sensing SoC leverage technologies such as Bluetooth and UWB to reduce cable complexity, enable lightweight design, and support low-latency, scalable communication. These solutions are well-suited to centralized computing platforms, where flexible integration of sensor data is crucial. With continuous technological advancement, wireless sensing SoC is expected to play a key role in achieving modular, intelligent, and lightweight automotive architectures.

Evolution of Battery Architecture Accelerates the Adoption of wBMS SoC

As power batteries evolve towards higher energy density, larger size, and higher reliability, traditional wired BMS architectures face increasing challenges in wiring complexity, failure risk, and maintainability. Trends toward simplifying battery structure, reducing the number of batteries, and increasing battery size make wBMS SoC more attractive. By eliminating signal wiring, wBMS SoC reduces system complexity, simplifies assembly, and improves packaging efficiency. It also enhances monitoring accuracy and reliability, which is essential for managing large batteries and controlling heat transfer. Additionally, wireless architecture enables greater modularity and smarter battery system management, aligning well with the future direction of software-defined cars.

Multi-Scenario Integration Promotes the emergence of Platform-Based Wireless Sensing SoC

Automotive wireless sensing SoC is moving toward multi-scenario integration, leading to a platform-based development path. SoC manufacturers are increasingly designing multi-functional SoCs that combine general sensing interfaces, ultra-low power wireless connections, and embedded intelligence. These platform-based SoCs offer high configurability and adaptability, enabling seamless integration of various automotive subsystems. Their core technologies also meet the needs of adjacent industries such as industrial automation and energy storage, promoting reuse across industries.


Get Whitepaper

List Announcement | Frost & Sullivan Supports Jianjie Electronic Technology (Jiangsu) Co., Ltd. in Successfully Listing in Hong Kong (6675.HK)

×
Please select job title category
Please select
×
Contact Us
Contact Us
Phone

Business Consultation Hotline

(021) 54075836

WeChat
QR Code

Scan to follow our official WeChat

Back to Top
Back to Top

Contact Us

×
Please select job title category
Please select
×