Semiconductor wet processing equipment refers to specialized devices that use chemical liquids or deionized water as the main medium during wafer manufacturing, packaging, and testing processes. These devices are used for cleaning, etching, developing, or stripping the surface of wafers. They are characterized by mild process conditions, low equipment costs, and minimal damage to wafers, making them an indispensable basic equipment in the semiconductor manufacturing process. Classified by core process use, they mainly include wet cleaning equipment, wet etching equipment, wet developing equipment, and wet stripping equipment. Among these, wet cleaning equipment and wet etching equipment have the highest usage frequency and market size, making them the core categories in the wet processing equipment system.
At the current stage, the growth of the equipment market is mainly driven by three factors: the semiconductor process continues to evolve towards advanced nodes, device structures become more complex and feature sizes continue to shrink, placing higher demands on the precision control, cleanliness level, and long-term stability of wet process equipment, directly driving the demand for high-end equipment; national semiconductor industry chain policies to achieve self-control and accelerate domestic substitution progress, with domestic wet process equipment having made substantial breakthroughs in mature processes and advanced cleaning technology fields; explosive growth in downstream sectors such as AI and new energy vehicles has driven large-scale construction of wafer factories and capacity expansion, further stimulating equipment procurement demand.
The market scale of semiconductor wet cleaning equipment in China increased from 9.35 billion yuan in 2020 to 22.82 billion yuan in 2024, with a compound annual growth rate of up to 25.0%. It is expected that the market scale will grow from 25.95 billion yuan to 40.80 billion yuan from 2025 to 2029, with a compound annual growth rate of 12.0%. The market scale of semiconductor wet etching equipment in China increased from 2.91 billion yuan in 2020 to 6.80 billion yuan in 2024, with a compound annual growth rate of 23.6%. It is expected that the market scale will grow from 7.65 billion yuan to 11.14 billion yuan from 2025 to 2029, with a compound annual growth rate of 9.9%.
Semiconductor wet process equipment refers to specialized systems that use chemical liquids or deionized water as the primary medium to perform cleaning, etching, developing, or stripping treatments on wafer surfaces during wafer fabrication and packaging/testing processes. Characterized by mild process conditions, lower equipment costs, and minimal wafer damage, these systems are indispensable in semiconductor manufacturing. Based on core process applications, they include wet cleaning, wet etching, wet developing, and wet stripping equipment, with wet cleaning and wet etching equipment being the highest-frequency and largest-market categories.
Market growth is driven by three key forces: continuous semiconductor process advancement towards smaller nodes, which demands higher precision, cleanliness, and long-term stability from wet process equipment; national policies accelerating domestic substitution, with Chinese wet process equipment achieving substantial breakthroughs in mature nodes and advanced cleaning technologies; and explosive downstream demand from AI and new energy vehicles driving large-scale wafer fab construction and capacity expansion.
China's semiconductor wet cleaning equipment market grew from RMB 93.5 billion in 2020 to RMB 228.2 billion in 2024, at a compound annual growth rate (CAGR) of 25.0%. From 2025 to 2029, the market is projected to grow from RMB 259.5 billion to RMB 408.0 billion, at a CAGR of 12.0%. China's semiconductor wet etching equipment market grew from RMB 29.1 billion in 2020 to RMB 68.0 billion in 2024, at a CAGR of 23.6%. From 2025 to 2029, the market is projected to grow from RMB 76.5 billion to RMB 111.4 billion, at a CAGR of 9.9%.
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