Cooperation Invitation | Frost & Sullivan Will Release '2026 Global New Computing Chips and Future Key Technology Development Industry Research Report'"

AI has become the core production factor of the digital economy, and computing power is the key infrastructure that supports the continuous evolution of the AI industry. As the parameters of large models leap from hundreds of millions to trillions, the demand for training and inference computing power is increasing exponentially. The global AI computing chip industry is experiencing unprecedented development opportunities. At the same time, the traditional general computing power approach represented by GPGPU faces dual constraints of external regulations and the limitations of Moore's Law. New types of AI computing chips, such as DATAFLOW and ASIC/DSA, are becoming the key force to address three major industry challenges—weak versatility, low computing efficiency, and weak scale expansion capabilities—and to meet the global demand for differentiated computing power. In 2026, the global AI chip industry has formed a technical landscape with two major camps—GPGPU and new computing chips—and three core approaches advancing simultaneously. The commercial prospects of new AI computing chips are continuously promising, supporting a future business potential of trillions of dollars.

Based on long-term insights into global cutting-edge technology and computing chip industries, Frost & Sullivan (hereinafter referred to as "Frost & Sullivan") will begin the preparation and writing of the "2026 Global Report on New AI Computing Chips and Future Key Technology Development." Through a comparative analysis of two major camps and three technical approaches, combined with a comprehensive industry chain map, detailed analysis of technical routes, a multi-dimensional perspective of market competition patterns, and corporate case studies, the report will deeply understand the development trends of the new AI computing chip industry, providing a global perspective for professionals in this field.

This report takes a global perspective, systematically outlines the development landscape of the new AI computing chip industry, clarifies the technical connotations and strategic positioning of new AI computing chips. Against the backdrop of "dual drivers for training and inference, and continuously rising computing power demands," it constructs a macro-driven model driven by AI computing demand explosion, technological breakthroughs under Moore's Law limitations, and policy autonomy and control. It clarifies the strategic position of new AI computing chips as the core infrastructure for industrial upgrading. Meanwhile, the report will also compare the definitions, core technical capabilities, and representative manufacturers of three core approaches—GPGPU, DATAFLOW, and ASIC/DSA—at the technical level. It analyzes the five core characteristics that high computing power, energy efficiency ratio, flexibility, versatility, and scalability that high-quality AI computing chips should possess, as well as the evolutionary potential of reconfigurable data flows in future technologies such as compute-network integration, three-dimensional integration, and wafer-level.

On this basis, the report will systematically analyze the industry chain panorama and value chain logic of upstream chip design and manufacturing, midstream computing products and systems, and downstream smart computing centers and application scenarios. It covers various application scenarios such as large model training and inference, edge inference, energy, finance, and the internet, and conducts in-depth analysis of key enterprises in the industry chain. Additionally, the report will focus on core markets such as China and the United States, comparing the differences and collaborative relationships between the industrial ecosystems, regulatory frameworks, and technical routes of different countries.

Furthermore, the report will systematically outline the investment and financing trends and capital market performance in the field of new AI computing chips, track the hot tracks and investment directions that capital is focusing on, and analyze the core challenges and breakthrough paths currently faced by the industry. At the same time, the report will include companies from the upstream and downstream of the industry chain, systematically presenting their business areas, product layouts, and technical platforms, highlighting their core competitiveness and product features.

Frost & Sullivan sincerely invites outstanding companies in the field of new AI computing chips to participate in this research. Together with multiple parties within the industry chain, we will jointly engage in the research and release process, forming a rational expression and consensus accumulation regarding industry development under a professional analysis framework, and working together to promote the high-quality development of the global new AI computing chip industry.

As a systematic research result in the field of new AI computing chips, this report will be widely released through Frost & Sullivan's official website, a global media matrix, and vertical channels in technology and industry. The report will deeply present the core advantages of participating companies, focusing on the innovation of new AI computing chips and reconfigurable architectures, the depth of product pipelines and implementation scenarios, key performance data, engineering progress, and cross-scenario adaptability and large-scale delivery capabilities. Through differentiated presentation, it will help the market establish a clear understanding of the companies' technical strength and industrialization capabilities, enhance industry influence and brand credibility, and provide an authoritative platform for companies to express themselves and showcase their products.

The report will build a communication platform connecting multiple parties in the new AI computing chip industry chain, promoting deep interaction and resource matching among enterprises with different positions. Chip architecture and chip product companies, computing system and complete machine companies, smart computing center and scenario application companies can differentiate their businesses, facilitate complementary integration of algorithms, computing power, core capabilities, and scenarios through precise matching, enhance mutual understanding with investment institutions and industry partners, and create more possibilities for technical collaboration, resource integration, and business expansion.

Based on the report's systematic analysis of the technical route for new AI computing chips, the commercial transformation path, and industrial evolution, the professional expertise of participating companies will be objectively presented. Through a deep exploration of the research content, the companies' recognition and influence in areas such as reconfigurable data streams, ASIC/DSA, data stream architecture, software-硬件 collaboration, and engineering delivery will be enhanced, supporting a distinct market positioning.

With Frost & Sullivan's network of investment institutions and industry partners in the fields of technology and industry, the release of the report will effectively increase the visibility of companies and connect with various types of capital. Early chip architecture innovation companies can reach VC/PEs interested in underlying technological innovation; companies at the engineering implementation stage can connect with industry capital and strategic investments from leading computing chip manufacturers interested in scenario closure and commercialization potential; large-scale delivery companies can attract strategic investors interested in manufacturing and delivery capabilities. It will build a communication bridge between companies and multiple capitals, taking the initiative in financing, technology licensing, mergers and acquisitions, and strategic cooperation.

Based on the deep communication established through the report cooperation, Frost & Sullivan can explore multiple collaborative directions with participating companies, including brand promotion, investment and financing consulting, growth strategy, etc. Both parties are expected to establish a long-term partnership based on this cooperation, jointly addressing industry changes and working together to promote the high-quality development of the new AI computing chip industry.

Participate in Cooperation

Please contact us

Jia Pang, Senior Partner and Managing Director of Frost & Sullivan China

Email:

sean.jia@frostchina.com

Wang Gengye, Executive Director of Frost & Sullivan China

Email:

gengye.wang@frostchina.com

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